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Specification
The QLG BGA Soldering Paste is a premium-grade material designed for precise and reliable soldering in high-precision circuit boards and BGA welding processes. With its unique formulation and exceptional performance, this paste ensures clean and efficient soldering results.
Key Features:
- High-Quality Formulation: Delivers superior soldering results.
- Easy Application: Smoothly applies to the board for precise placement of components.
- Reliable Performance: Prevents false soldering and ensures strong connections.
- Wide Compatibility: Suitable for various electronic applications.
- 500g Quantity: Provides ample supply for multiple projects.
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